Integration Engineer - BCD Technology
At a glance
Mid-level Software Engineering role at onsemi. Hopewell Junction · full-time · $127,800–$217,000 base.
techroles summary, based on the employer's posting.
What you'll do
- Drive BCD platform improvements from development into qualification and readiness for production
- Coordinate device, process, and integration work to resolve issues across coupled process modules
- Build manufacturing robustness through yield learning, reliability work, process-window definition, tooling readiness, and defect control
- Integrate BEOL options such as MIM capacitors, copper metallization, CMP, and dielectric modules
- Support qualification with standardized test vehicles and post-fab readiness activities
What you bring
- A BS or higher in engineering or materials science, plus at least two years of relevant experience
- Hands-on background in semiconductor integration and technology development, including BEOL process work
- Knowledge of 5S, 8D, six sigma, SPC, DOE, or FMEA methods
- Experience in or alongside advanced 300 mm semiconductor fabs
Who this fits
This mid-level engineering role suits someone comfortable making integration trade-offs across device and process modules and driving technical problems to resolution. The role is based at the Hopewell Junction, New York site.
From the employer
onsemi is seeking a Technology BCD Integration Engineer in our Hopewell Junction, NY, site. Engineers on this team work across device, process, and integration disciplines to deliver advanced BCD technologies from concept through qualification and readiness for volume manufacturing. In addition to driving new technology development, team members are responsible for ensuring the technology is robust, manufacturable, and production‑ready, including yield learning, reliability, process window definition, tooling readiness, defectivity control, and managing complex interactions across highly coupled process flows that often span multiple modules and stakeholders.
You’ll thrive in this role if you enjoy working at the intersection of technology development and manufacturing readiness, are comfortable navigating trade‑offs across integrated device and process modules, and take ownership of driving complex technical issues to closure in an advanced manufacturing environment.
This role sits at the critical intersection between technology development and manufacturing readiness. The work you do directly determines whether new BCD platforms successfully transition from promising concepts into reliable, scalable technologies that enable next‑generation products across power, automotive, industrial, and imaging markets. Strong execution in this role accelerates time‑to‑market, reduces downstream risk, and sets the foundation for success at onsemi’s most advanced fab.
Representative Projects May Include
- Driving high‑voltage BCD platform enhancements from development through qualification and manufacturing readiness.
- Integrating embedded non‑volatile memory modules into an established BCD technology.
- Enabling ROIC‑optimized process flows and advanced capacitor (MIM) options, including integration and manufacturability trade‑offs within a complex BEOL stack.
- Developing low‑power and low‑noise CMOS options to improve performance in sensitive analog and imaging applications.
- Improving DMOS performance and reliability through targeted device and process integration changes, with emphasis on qualification and manufacturability.
- Supporting packaging and post‑fab readiness using standardized test vehicles to accelerate technology qualification.
Preferred Qualifications
- Education: BS or higher degree in Engineering or Materials Science
- Experience: 2-4 years or more of relevant experience in semiconductor manufacturing integration and technology development.
- Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
- Demonstrated experience with back‑end‑of‑line (BEOL) process integration, including areas such as MIM capacitors, copper metallization, CMP, dielectric integration, or related BEOL modules.
- Familiarity with post‑fab process considerations (e.g., probe, backgrind, backside metallization, or packaging interfaces) as they relate to technology qualification and manufacturability.
- Strong technical judgment and ability to drive complex, cross‑module integration decisions with limited precedent.
- Experience working in or alongside advanced 300 mm semiconductor manufacturing environments.
Salary: onsemi is excited to share the base salary range for this position is $127,800 to $217,000 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
Software Engineering work from LinkedIn, X, Reddit and Upwork, in one list.
Each morning you get everything that fits, strongest first.
Software Engineering$120k+
Find me workBy the team behind techroles.