3D Heterogeneous Integration Engineer (2026 New College Graduate)
At a glance
Mid-level Software Engineering role at Globalfoundries. New York · full-time · $65,400–$145,800 base.
techroles summary, based on the employer's posting.
What you'll do
- Plan through-silicon via process development with unit-process engineers, tools and materials teams
- Work with outsourced assembly and test partners to create wafer-level integration processes
- Build process knowledge across etch, lithography, plating and CMP, then investigate why failures occur
- Improve integration flows to raise yield and cut cycle time and cost
- Plan end-to-end integration for new capabilities, prototypes and qualification across programs
What you bring
- A defended PhD or a master's in electrical engineering, materials science or a related field
- At least a 3.0 overall GPA, good academic standing and written and spoken English fluency
Who this fits
This new-college-graduate role suits you if you want to develop advanced packaging and wafer integration processes at the Malta, New York facility. Travel may reach ten percent.
From the employer
About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role:
GlobalFoundries Fab8 is seeking a motivated integration engineer to become part of our state-of-the-art 300mm fabrication facility in Malta, New York. This role will drive new development to enable our next-generation advanced packaging R&D efforts.
Essential Responsibilities:
- Lead TSV process development efforts and planning by working with the unit process engineers and directly with the tools & materials for the Malta Fab 8 Advanced Semiconductor fab.
- Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level Integration processes.
- Develop expertise in the processes (such as ETCH, Litho, Plating, and CMP), materials and tooling leveraging available characterization resources.
- Drive mechanistic understanding of failure modes.
- Develop integration schemes to continuously improve yields and to reduce cycle-time and costs. Generate IP related to novel wafer integration & packaging technology.
- Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
Other Responsibilities:
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Other duties as assigned by manager.
Required Qualifications:
- Education – PhD with completed defended thesis or Master's in Electrical Engineering and Materials Science or related field from an accredited degree program.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency - English (Written & Verbal).
- Travel - Up to 10%.
Preferred Qualifications:
- Prior-related internship or co-op experience in process engineering or integration.
- Fundamental knowledge of semiconductor packaging processes.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
- Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
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Expected Salary Range
$65,400.00 - $145,800.00The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law
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